WSPC Series in Advanced Integration and Packaging
Bibliographic Information
- Title
- "WSPC Series in Advanced Integration and Packaging"
- Statement of Responsibility
- Series editors, Avram Bar-Cohen, Shi-Wei Ricky Lee
- Publisher
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- World Scientific
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Details 詳細情報について
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- CRID
- 1130000795932383232
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- NII Book ID
- BB1511171X
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- Country Code
- si
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- Title Language Code
- en
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- Place of Publication
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- Singapore
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- Data Source
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- CiNii Books