Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
書誌事項
- タイトル
- "Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii"
- 責任表示
- sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee
- 出版者
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- American Society of Mechanical Engineers
- 出版年月
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- c1999
- 書籍サイズ
- 28 cm
- シリーズ名/番号
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- :set
- タイトル別名
-
- Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference
- INTERpack '99
この図書・雑誌をさがす
注記
Includes bibliographic references and indexes
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詳細情報 詳細情報について
-
- CRID
- 1130000796165884416
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- NII書誌ID
- BA44132104
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- ISBN
- 0791816125
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- LCCN
- 97073292
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- Web Site
- https://lccn.loc.gov/97073292
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- 本文言語コード
- en
-
- 出版国コード
- us
-
- タイトル言語コード
- en
-
- 出版地
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- New York, N.Y
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- 分類
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- LCC: TK7870.15
- DC21: 621.381/046
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- 件名
-
- データソース種別
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- CiNii Books