Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii

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書誌事項

タイトル
"Advances in electronic packaging, 1999 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii"
責任表示
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee
出版者
  • American Society of Mechanical Engineers
出版年月
  • c1999
書籍サイズ
28 cm
シリーズ名/番号
  • :set
タイトル別名
  • Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference
  • INTERpack '99

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Includes bibliographic references and indexes

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