Polymeric materials for electronics packaging and interconnection
Bibliographic Information
- Title
- "Polymeric materials for electronics packaging and interconnection"
- Statement of Responsibility
- John H. Lupinski, editor, Robert S. Moore, editor
- Publisher
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- American Chemical Society
- Publication Year
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- 1989
- Book size
- 24 cm
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Notes
"Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988."
Includes bibliographical references and indexes
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Details 詳細情報について
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- CRID
- 1130000796213153664
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- NII Book ID
- BA07647444
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- ISBN
- 0841216797
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- LCCN
- 89037412
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- Web Site
- https://lccn.loc.gov/89037412
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Washington, DC
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- Classification
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- LCC: TK7870
- DC20: 621.381/046
- NDLC: ND351
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- Subject
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- Data Source
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- CiNii Books