Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

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Bibliographic Information

Title
"Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications"
Statement of Responsibility
edited by Ulrich Gösele ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology Divisions
Publisher
  • Electrochemical Society
Publication Year
  • c1992
Book size
23 cm
Other Title
  • Semiconductor wafer bonding: science, technology, and applications

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Notes

Symposium held in Phoenix, Ariz., Oct. 13-18, 1991

Includes bibliographical references and indexes

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Details 詳細情報について

  • CRID
    1130000796213596544
  • NII Book ID
    BA14412564
  • ISBN
    1566770084
  • LCCN
    92071337
  • Web Site
    https://lccn.loc.gov/92071337
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • Pennington, NJ
  • Data Source
    • CiNii Books
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