Materials, integration and packaging issues for high-frequency devices

CiNii Available at 5 libraries

Bibliographic Information

Title
"Materials, integration and packaging issues for high-frequency devices"
Publisher
  • Materials Research Society
Publication Year
  • c2004-
Book size
24 cm
Series Name / No
  • [1]
  • 2

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Notes

Includes bibliographical references and indexes

1st symposium was held in December 1-3, 2003, Boston, Massachusetts, U.S.A.

2nd symposium was held in November 29-December 1, 2004, Boston, Massachusetts, U.S.A.

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Details 詳細情報について

  • CRID
    1130000796460484224
  • NII Book ID
    BA67311055
  • ISBN
    1558997210
    1558997814
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • Warrendale, Pa.
  • Data Source
    • CiNii Books
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