Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

Web Site CiNii Available at 1 libraries

Bibliographic Information

Title
"Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California"
Statement of Responsibility
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1995
Book size
28 cm

Search this Book/Journal

Notes

Includes bibliographical references and index

Related Books

See more

Details 詳細情報について

Back to top