Mechanics and materials for electronic packaging : volume 3. coupled field behavior in materials : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

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Bibliographic Information

Title
"Mechanics and materials for electronic packaging : volume 3. coupled field behavior in materials : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994"
Statement of Responsibility
co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.L. Dunn ... [et al.]
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1994
Book size
28 cm

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Details 詳細情報について

  • CRID
    1130000796644097280
  • NII Book ID
    BA24223535
  • ISBN
    0791814424
  • LCCN
    94079149
  • Web Site
    https://lccn.loc.gov/94079149
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • New York
  • Data Source
    • CiNii Books
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