Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, Suhir, Ephraim

Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France

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Bibliographic Information

Title: "Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France"

Statement of Responsibility: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir

Publisher

The American Society of Mechanical Engineers

Publication Year

c1998

Book size: 28 cm

Series Name / No

: pbk

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Notes

Includes bibliographical references and index

"In cooperation with IEEE Components, Packaging, and Manufacturing Technology(CPMT) Society, International Microelectronics and Packaging Society(IMAPS), Society of Plastics Engineering(SPE), The Association française de mecanique(AFM)

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