Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993

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書誌事項

タイトル
"Solutions to CFD benchmark problems in electronic packaging : presented at the 29th National Heat Transfer Conference, Atlanta, Georgia, August 8-11, 1993"
責任表示
sponsored by the Heat Transfer Division, ASME ; edited by D. Agonafer
出版者
  • American Society of Mechanical Engineers
出版年月
  • c1993
書籍サイズ
28 cm

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注記

Includes bibliographical references and index

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