Microelectronic interconnects and packages, system and process integration

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Bibliographic Information

Title
"Microelectronic interconnects and packages, system and process integration"
Statement of Responsibility
Stuart K. Tewksbury, John R. Carruthers, conference chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering, cooperating organizations, Components, Hybrids, and Manufacturing Technology Society of the IEEE, Computer Society of the IEEE
Publisher
  • SPIE
Publication Year
  • c1991
Book size
28 cm

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Notes

Papers from the International Symposium on Advances in Interconnection and Packaging, held 5-9 Nov. 1990, Boston, Mass.

Includes bibliographical references and index

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