Second International Conference on Thin Film Physics and Applications : '94 TFPA : 15-17 April 1994, Shanghai, China

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Bibliographic Information

Title
"Second International Conference on Thin Film Physics and Applications : '94 TFPA : 15-17 April 1994, Shanghai, China"
Statement of Responsibility
Zhou Shixun ... [et al.] ; cosponsored by Chinese Physical Society, Shanghai Physical Society
Publisher
  • SPIE
Publication Year
  • c1994
Book size
28 cm

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Notes

Includes bibliographical references and index

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Details 詳細情報について

  • CRID
    1130000797317441792
  • NII Book ID
    BA28170554
  • ISBN
    0819417084
  • LCCN
    94067838
  • Web Site
    https://lccn.loc.gov/94067838
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • Bellingham, Wash.
  • Data Source
    • CiNii Books
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