Second International Conference on Thin Film Physics and Applications : '94 TFPA : 15-17 April 1994, Shanghai, China
Bibliographic Information
- Title
- "Second International Conference on Thin Film Physics and Applications : '94 TFPA : 15-17 April 1994, Shanghai, China"
- Statement of Responsibility
- Zhou Shixun ... [et al.] ; cosponsored by Chinese Physical Society, Shanghai Physical Society
- Publisher
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- SPIE
- Publication Year
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- c1994
- Book size
- 28 cm
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Notes
Includes bibliographical references and index
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Details 詳細情報について
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- CRID
- 1130000797317441792
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- NII Book ID
- BA28170554
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- ISBN
- 0819417084
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- LCCN
- 94067838
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- Web Site
- https://lccn.loc.gov/94067838
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Bellingham, Wash.
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- Data Source
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- CiNii Books