Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California

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Bibliographic Information

Title
"Sensors in electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California"
Statement of Responsibility
sponsored by the Manufacturing Engineering Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Charles Ume, Chao Pin-Yeh
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1995
Book size
28 cm

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Notes

Includes bibliographical references and index

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