Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability

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Bibliographic Information

Title
"Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability"
Statement of Responsibility
[edited by] Michael Pecht
Publisher
  • Wiley
Publication Year
  • c1994
Book size
25 cm

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Notes

Includes bibliographical references and index

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