Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium
Bibliographic Information
- Title
- "Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium"
- Statement of Responsibility
- editors, R. Singh ... [et al.] ; [sponsord by] Dielectric Science and Technology and Electronics Divisions
- Publisher
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- Electrochemical Society
- Publication Year
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- c2000
- Book size
- 24 cm
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Notes
"Both the symposia were held in Seattle at the 195th Meeting of the Electrochemical Society, May 2-7, 1999 ... sponsored by the Dielectric Science and Technology Division. The other symposium was sponsored jointly by the Dielectric Science and Technology/Electronics Divisions of the Electrochemical Society"--on pref
Includes bibliographical references and indexes
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Details 詳細情報について
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- CRID
- 1130000797705735680
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- NII Book ID
- BA54510853
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- ISBN
- 156677229X
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- LCCN
- 99069939
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- Web Site
- https://lccn.loc.gov/99069939
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Pennington, N.J.
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- Classification
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- LCC: TK7872.D53
- DC21: 537/.24
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- Subject
-
- Data Source
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- CiNii Books