Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993
書誌事項
- タイトル
- "Thermal management, solder technology, optoelectronics packaging : Advances in electronic packaging, 1993 : proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993"
- 責任表示
- sponsored by the American Society of Mechanical Engineers ; edited by P.A. Engel, W.T. Chen
- 出版者
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- American Society of Mechanical Engineers
- 出版年月
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- c1993
- 書籍サイズ
- 28 cm
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詳細情報 詳細情報について
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- CRID
- 1130000798391149696
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- NII書誌ID
- BA21835761
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- ISBN
- 0791806863
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- LCCN
- 92053846
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- Web Site
- https://lccn.loc.gov/92053846
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- 本文言語コード
- en
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- 出版国コード
- us
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- タイトル言語コード
- en
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- 出版地
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- New York (345 E. 47th St., New York)
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- 分類
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- LCC: TK7870.15
- DC20: 621.381/046
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- 件名
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- データソース種別
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- CiNii Books