Thermal modeling and design of electronic systems and devices : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Dallas, Texas, November 25-30, 1990
Bibliographic Information
- Title
- "Thermal modeling and design of electronic systems and devices : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Dallas, Texas, November 25-30, 1990"
- Statement of Responsibility
- sponsored by the Heat Transfer Division, ASME ; edited by R.A. Wirtz, G.L. Lehmann
- Publisher
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- American Society of Mechanical Engineers
- Publication Year
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- c1990
- Book size
- 28 cm
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Notes
Includes bibliographical references
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Details 詳細情報について
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- CRID
- 1130282269367211264
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- NII Book ID
- BA1947139X
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- ISBN
- 0791805867
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- LCCN
- 90056031
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- Web Site
- https://lccn.loc.gov/90056031
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- New York, N.Y.
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- Data Source
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- CiNii Books