Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

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Bibliographic Information

Title
"Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993"
Statement of Responsibility
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by L. T. Nguyen, M.G. Pecht
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1993
Book size
ill. ; 28 cm

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Details 詳細情報について

  • CRID
    1130282269626859520
  • NII Book ID
    BA21709370
  • ISBN
    0791810356
  • LCCN
    93093270
  • Web Site
    https://lccn.loc.gov/93093270
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • New York, N.Y.
  • Data Source
    • CiNii Books
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