Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

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Bibliographic Information

Title
"Manufacturing aspects in electronic packaging 1993 : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993"
Statement of Responsibility
sponsored by the Production Engineering Division and the Electrical and Electronic Packaging Division, ASME ; edited by Y.C. Lee ... [et al.]
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1993
Book size
ill. ; 28 cm

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Details 詳細情報について

  • CRID
    1130282270282831360
  • NII Book ID
    BA21718247
  • ISBN
    0791810321
  • LCCN
    93073267
  • Web Site
    https://lccn.loc.gov/93073267
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • New York, N.Y.
  • Data Source
    • CiNii Books
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