International Conference on Thin Film Physics and Applications : '91 TFPA : 15-17 April 1991, Shanghai, China
Bibliographic Information
- Title
- "International Conference on Thin Film Physics and Applications : '91 TFPA : 15-17 April 1991, Shanghai, China"
- Statement of Responsibility
- sponsored by Chinese Physical Society, Shanghai Physical Society ; cosponsors, Association of Asia Pacific Physical Societies ... [et al.]
- Publisher
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- SPIE
- Publication Year
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- c1991
- Book size
- 28 cm
- Series Name / No
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- pt. 1
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Notes
Includes bibliographical references and index
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Details 詳細情報について
-
- CRID
- 1130282271429229056
-
- NII Book ID
- BA26189154
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- ISBN
- 0819406465
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- LCCN
- 91062819
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- Web Site
- https://lccn.loc.gov/91062819
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Bellingham, Wash.
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- Subject
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- LCSH: Thin films -- Congresses
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- Data Source
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- CiNii Books