Quality conformance and qualification of microelectronic packages and interconnects
Bibliographic Information
- Title
- "Quality conformance and qualification of microelectronic packages and interconnects"
- Statement of Responsibility
- edited by Michael Pecht ... [et al.]
- Publisher
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- Wiley
- Publication Year
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- c1994
- Book size
- 25 cm
- Series Name / No
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- : alk. paper
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Notes
Includes bibliographical references (p. 419-450) and index
入力は遡及データによる
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Details 詳細情報について
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- CRID
- 1130282271499988864
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- NII Book ID
- BA27997777
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- ISBN
- 0471594369
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- LCCN
- 93009709
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- Web Site
- https://lccn.loc.gov/93009709
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- New York
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- Classification
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- LCC: TK7870.15
- DC20: 621.381/046
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- Subject
-
- Data Source
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- CiNii Books