Mechanics and materials for electronic packaging : volume 1. design and process issues in electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
書誌事項
- タイトル
- "Mechanics and materials for electronic packaging : volume 1. design and process issues in electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994"
- 責任表示
- co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et
- 出版者
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- American Society of Mechanical Engineers
- 出版年月
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- c1994
- 書籍サイズ
- 28 cm
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詳細情報 詳細情報について
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- CRID
- 1130282271710789632
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- NII書誌ID
- BA24223488
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- ISBN
- 0791814491
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- LCCN
- 94079149
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- Web Site
- https://lccn.loc.gov/94079149
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- 本文言語コード
- en
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- 出版国コード
- us
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- タイトル言語コード
- en
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- 出版地
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- New York
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- データソース種別
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- CiNii Books