Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.
CiNii
Available at 3 libraries
Bibliographic Information
- Title
- "Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A."
- Statement of Responsibility
- editors, Ting Y. Tsui ... [et al.]
- Publisher
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- Materials Research Society
- Publication Year
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- c2006
- Book size
- 24 cm
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Notes
"... Symposium F, "Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects," held April 18-21 at the 2006 MRS Spring Meeting in San Francisco, California ..."--Pref
Includes bibliographical references and indexes
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Details 詳細情報について
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- CRID
- 1130282272684293504
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- NII Book ID
- BA78618898
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- Text Lang
- en
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- Country Code
- us
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- Title Language Code
- en
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- Place of Publication
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- Warrendale, Pa.
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- Data Source
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- CiNii Books