Bibliographic Information
- Title
- "Semiconductor wafer bonding : science and technology"
- Statement of Responsibility
- Q. -Y. Tong, U. Gösele
- Publisher
-
- John Wiley
- Publication Year
-
- c1999
- Book size
- 24 cm
Search this Book/Journal
Notes
Includes index
- Tweet
Details 詳細情報について
-
- CRID
- 1130282272917646208
-
- NII Book ID
- BA41392663
-
- ISBN
- 0471574813
-
- LCCN
- 98024397
-
- Web Site
- https://lccn.loc.gov/98024397
-
- Text Lang
- en
-
- Country Code
- us
-
- Title Language Code
- en
-
- Place of Publication
-
- New York
-
- Classification
-
- LCC: TK7871.85
- DC21: 621.3815/2
-
- Subject
-
- LCSH: Semiconductors -- Bonding
- LCSH: Semiconductor wafers
-
- Data Source
-
- CiNii Books