Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

Web Site CiNii Available at 1 libraries

Bibliographic Information

Title
"Mechanics and materials for electronic packaging : volume 2. thermal and mechanical behavior and modeling : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994"
Statement of Responsibility
co-sponsored by the Applied Mechanics, Electrical and Electronic Packaging, Materials, and Production Engineering Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME ; edited by M.A. Schen ... [et al.]
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1994
Book size
28 cm

Search this Book/Journal

Related Books

See more

Details 詳細情報について

  • CRID
    1130282273273795328
  • NII Book ID
    BA24222805
  • ISBN
    0791814270
  • LCCN
    94079149
  • Web Site
    https://lccn.loc.gov/94079149
  • Text Lang
    en
  • Country Code
    us
  • Title Language Code
    en
  • Place of Publication
    • New York
  • Data Source
    • CiNii Books
Back to top