Bibliographic Information
- Title
- "Solder materials"
- Statement of Responsibility
- Kwang-Lung Lin
- Publisher
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- World Scientific
- Publication Year
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- c2018
- Book size
- 24 cm
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Notes
Includes bibliographical references and index
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Details 詳細情報について
-
- CRID
- 1130282273371251584
-
- NII Book ID
- BB28323630
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- ISBN
- 9789813237605
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- LCCN
- 2018288926
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- Web Site
- https://lccn.loc.gov/2018288926
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- Text Lang
- en
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- Country Code
- si
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- Title Language Code
- en
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- Place of Publication
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- Singapore
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- Subject
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- LCSH: Solder and soldering
- LCSH: Solder pastes
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- Data Source
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- CiNii Books