Comparison between Damage Characteristics of p- and n-GaN Surfaces Etched by Capacitively Coupled Radio Frequency Argon Plasmas

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<jats:p> Damage characteristics of p-GaN surfaces etched by capacitively coupled radio frequency Ar plasma at various gas pressures have been studied in terms of the ultraviolet (UV) light irradiation effect. The UV light corresponding to Ar II is emitted from the plasma at high gas pressures from 50 to 100 mTorr, whereas no UV light is emitted at a low gas pressure of 10 mTorr. The result of the etched p-GaN surface is compared with that of the etched n-GaN surface. The difference between the results of the p- and n-GaN surfaces depends strongly on the gas pressure. Both the experimental N/Ga ratios at the p- and n-GaN surfaces etched at the low gas pressure decrease with increasing etching time. The decreases in the experimental N/Ga ratios agree with the simulation results that N atoms at the p- and n-GaN surfaces are preferentially removed by Ar<jats:sup>+</jats:sup> ions. The morphologies of the p- and n-GaN surfaces etched at the low gas pressure are similar to those of the as-grown surfaces. The damage characteristic of the p-GaN surface induced in the absence of the UV light irradiation also appears at the high gas pressures, although the p-GaN surfaces etched at the high gas pressures are irradiated with the emitted UV light. In contrast, both the experimental N/Ga ratios and morphologies of the n-GaN surfaces etched at the high gas pressures change with increasing etching time. The changes in the n-GaN surfaces probably result from the UV light irradiation. </jats:p>

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