Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effects
書誌事項
- 公開日
- 2008-01
- 権利情報
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- https://www.elsevier.com/tdm/userlicense/1.0/
- DOI
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- 10.1016/j.microrel.2007.01.090
- 公開者
- Elsevier BV
この論文をさがす
収録刊行物
-
- Microelectronics Reliability
-
Microelectronics Reliability 48 (1), 45-50, 2008-01
Elsevier BV