Electroless deposition of copper in acidic solutions using hypophosphite reducing agent

詳細情報 詳細情報について

• CRID

  1360011146578303232

• DOI

  10.1007/s10800-005-9025-7

• ISSN

  15728838

  0021891X

• Web Site

  http://link.springer.com/content/pdf/10.1007/s10800-005-9025-7.pdf

  http://link.springer.com/article/10.1007/s10800-005-9025-7/fulltext.html

  http://link.springer.com/content/pdf/10.1007/s10800-005-9025-7

• データソース種別

  • Crossref