Direct gold bonding for flexible integrated electronics
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- Masahito Takakuwa
- Department of Modern Mechanical Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
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- Kenjiro Fukuda
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.
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- Tomoyuki Yokota
- Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.
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- Daishi Inoue
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.
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- Daisuke Hashizume
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.
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- Shinjiro Umezu
- Department of Modern Mechanical Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan.
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- Takao Someya
- Center for Emergent Matter Science, RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.
説明
<jats:p>Water vapor plasma treatment enables direct gold bonding on flexible polymer films in air at ambient temperatures.</jats:p>
収録刊行物
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- Science Advances
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Science Advances 7 (52), 6228-, 2021-12-24
American Association for the Advancement of Science (AAAS)
