Influence of temperature on the curing of an epoxy adhesive and its influence on bond behaviour of NSM-CFRP systems
書誌事項
- 公開日
- 2016-03
- 権利情報
-
- https://www.elsevier.com/tdm/userlicense/1.0/
- DOI
-
- 10.1016/j.compositesb.2015.11.034
- 公開者
- Elsevier BV
この論文をさがす
収録刊行物
-
- Composites Part B: Engineering
-
Composites Part B: Engineering 89 219-229, 2016-03
Elsevier BV