Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing
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- Norio Chujo
- Tokyo Institute of Technology, IIR, The WOW alliance,Yokohama,Japan
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- Hiroyuki Ryoson
- Tokyo Institute of Technology, IIR, The WOW alliance,Yokohama,Japan
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- Koji Sakui
- Tokyo Institute of Technology, IIR, The WOW alliance,Yokohama,Japan
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- Shinji Sugatani
- Tokyo Institute of Technology, IIR, The WOW alliance,Yokohama,Japan
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- Tomoji Nakamura
- Tokyo Institute of Technology, IIR, The WOW alliance,Yokohama,Japan
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- Takayuki Ohba
- Tokyo Institute of Technology, IIR, The WOW alliance,Yokohama,Japan
Journal
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- 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023-05
IEEE