Technology Roadmap for Flexible Sensors

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  • Yifei Luo
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
  • Mohammad Reza Abidian
    Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
  • Jong-Hyun Ahn
    School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
  • Deji Akinwande
    Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
  • Anne M. Andrews
    Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Markus Antonietti
    Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
  • Zhenan Bao
    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
  • Magnus Berggren
    Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
  • Christopher A. Berkey
    Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
  • Christopher John Bettinger
    Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
  • Jun Chen
    Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Peng Chen
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
  • Wenlong Cheng
    Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
  • Xu Cheng
    Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
  • Seon-Jin Choi
    Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
  • Alex Chortos
    School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
  • Canan Dagdeviren
    Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
  • Reinhold H. Dauskardt
    Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
  • Chong-an Di
    Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  • Michael D. Dickey
    Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
  • Xiangfeng Duan
    Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Antonio Facchetti
    Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
  • Zhiyong Fan
    Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
  • Yin Fang
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
  • Jianyou Feng
    State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
  • Xue Feng
    Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
  • Huajian Gao
    School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
  • Wei Gao
    Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
  • Xiwen Gong
    Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
  • Chuan Fei Guo
    Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
  • Xiaojun Guo
    National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
  • Martin C. Hartel
    Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Zihan He
    Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
  • John S. Ho
    Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
  • Youfan Hu
    School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
  • Qiyao Huang
    School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
  • Yu Huang
    Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Fengwei Huo
    Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
  • Muhammad M. Hussain
    mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
  • Ali Javey
    Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
  • Unyong Jeong
    Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
  • Chen Jiang
    Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
  • Xingyu Jiang
    Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
  • Jiheong Kang
    Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
  • Daniil Karnaushenko
    Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
  • Ali Khademhosseini
    Terasaki Institute for Biomedical Innovation, Los Angeles, CA, USA
  • Dae-Hyeong Kim
    Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
  • Il-Doo Kim
    Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
  • Dmitry Kireev
    Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
  • Lingxuan Kong
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
  • Chengkuo Lee
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
  • Nae-Eung Lee
    School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
  • Pooi See Lee
    School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
  • Tae-Woo Lee
    Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
  • Fengyu Li
    College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
  • Jinxing Li
    Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
  • Cuiyuan Liang
    School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
  • Chwee Teck Lim
    Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
  • Yuanjing Lin
    School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
  • Darren J. Lipomi
    Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
  • Jia Liu
    John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
  • Kai Liu
    School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
  • Nan Liu
    Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
  • Ren Liu
    John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
  • Yuxin Liu
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
  • Yuxuan Liu
    Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
  • Zhiyuan Liu
    Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
  • Zhuangjian Liu
    Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
  • Xian Jun Loh
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
  • Nanshu Lu
    Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
  • Zhisheng Lv
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
  • Shlomo Magdassi
    Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
  • George G. Malliaras
    Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
  • Naoji Matsuhisa
    Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan;
  • Arokia Nathan
    Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
  • Simiao Niu
    Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
  • Jieming Pan
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
  • Changhyun Pang
    School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
  • Qibing Pei
    Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Huisheng Peng
    State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
  • Dianpeng Qi
    School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
  • Huaying Ren
    Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
  • John A. Rogers
    Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
  • Aaron Rowe
    Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
  • Oliver G. Schmidt
    Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
  • Tsuyoshi Sekitani
    The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
  • Dae-Gyo Seo
    Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
  • Guozhen Shen
    School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
  • Xing Sheng
    Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
  • Qiongfeng Shi
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
  • Takao Someya
    Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
  • Yanlin Song
    Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
  • Eleni Stavrinidou
    Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
  • Meng Su
    Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
  • Xuemei Sun
    State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
  • Kuniharu Takei
    Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
  • Xiao-Ming Tao
    Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
  • Benjamin C. K. Tee
    Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
  • Aaron Voon-Yew Thean
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
  • Tran Quang Trung
    School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
  • Changjin Wan
    School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
  • Huiliang Wang
    Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
  • Joseph Wang
    Department of Nanoengineering, University of California, San Diego, California 92093, United States
  • Ming Wang
    Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
  • Sihong Wang
    Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
  • Ting Wang
    State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
  • Zhong Lin Wang
    Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
  • Paul S. Weiss
    California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
  • Hanqi Wen
    School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
  • Sheng Xu
    Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
  • Tailin Xu
    School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
  • Hongping Yan
    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
  • Xuzhou Yan
    School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
  • Hui Yang
    Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
  • Le Yang
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
  • Shuaijian Yang
    School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
  • Lan Yin
    School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
  • Cunjiang Yu
    Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
  • Guihua Yu
    Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
  • Jing Yu
    School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
  • Shu-Hong Yu
    Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
  • Xinge Yu
    Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
  • Evgeny Zamburg
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
  • Haixia Zhang
    National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
  • Xiangyu Zhang
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
  • Xiaosheng Zhang
    School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
  • Xueji Zhang
    School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
  • Yihui Zhang
    Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
  • Yu Zhang
    Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
  • Siyuan Zhao
    John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
  • Xuanhe Zhao
    Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
  • Yuanjin Zheng
    Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
  • Yu-Qing Zheng
    National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
  • Zijian Zheng
    Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
  • Tao Zhou
    Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
  • Bowen Zhu
    Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
  • Ming Zhu
    Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
  • Rong Zhu
    Department of Precision Instrument, Tsinghua University, Beijing 100084, China
  • Yangzhi Zhu
    Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
  • Yong Zhu
    Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
  • Guijin Zou
    Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
  • Xiaodong Chen
    Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
  • School of Materials Science and Engineering
  • School of Mechanical and Aerospace Engineering
  • School of Electrical and Electronic Engineering
  • Innovative Center for Flexible Devices (iFLEX)
  • School of Chemistry, Chemical Engineering and Biotechnology
  • Institute for Digital Molecular Analytics and Science (IDMxS)
  • Institute of Materials Research and Engineering, A*STAR
  • Center for Integrated Circuits and Systems
  • Institute of High Performance Computing, A*STAR
  • Singapore-HUJ Alliance for Research and Enterprise (SHARE)

書誌事項

公開日
2023-03-09
資源種別
journal article
権利情報
  • https://doi.org/10.15223/policy-029
  • https://doi.org/10.15223/policy-037
  • https://doi.org/10.15223/policy-045
DOI
  • 10.1021/acsnano.2c12606
公開者
American Chemical Society (ACS)

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説明

Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.

収録刊行物

  • ACS Nano

    ACS Nano 17 (6), 5211-5295, 2023-03-09

    American Chemical Society (ACS)

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