Biphasic Liquid Metal Composites for Sinter‐Free Printed Stretchable Electronics
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- Abdollah Hajalilou
- Institute of Systems and Robotics Department of Electrical Engineering University of Coimbra Coimbra 3030‐290 Portugal
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- André F. Silva
- Institute of Systems and Robotics Department of Electrical Engineering University of Coimbra Coimbra 3030‐290 Portugal
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- Pedro Alhais Lopes
- Institute of Systems and Robotics Department of Electrical Engineering University of Coimbra Coimbra 3030‐290 Portugal
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- Elahe Parvini
- Institute of Systems and Robotics Department of Electrical Engineering University of Coimbra Coimbra 3030‐290 Portugal
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- Carmel Majidi
- Integrated Soft Materials Lab Department of Mechanical Engineering Carnegie Mellon University Pittsburgh PA 15213 USA
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- Mahmoud Tavakoli
- Institute of Systems and Robotics Department of Electrical Engineering University of Coimbra Coimbra 3030‐290 Portugal
書誌事項
- 公開日
- 2022-01-05
- 権利情報
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- http://onlinelibrary.wiley.com/termsAndConditions#vor
- DOI
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- 10.1002/admi.202101913
- 公開者
- Wiley
この論文をさがす
説明
<jats:title>Abstract</jats:title><jats:p>This work introduces and presents a comprehensive study on a series of biphasic liquid metal (LM) composites that benefit from high conductivity, excellent stretchability, a low gauge‐factor, excellent adhesion to a wide range of substrates, for sinter‐free writing complex stretchable circuits. These trinary material systems are composed of a block‐co‐polymer binder, EGaIn liquid metal, and a microparticle (μP) filler (Ag flakes, Ag‐coated‐Ni, Ag‐coated‐Fe, Ni, Ferrite, or TiC). They combine the fluidic behavior, resilience, and self‐healing properties of LMs, and the printability, adhesion, and elastic integrity of elastomers. Unlike the previous efforts with LM‐polymer composites and printed EGaIn nanodroplets, these composites are intrinsically conductive and do not require any thermal/optical/mechanical sintering. The binary combinations (LM‐SIS, LM‐Ag, Ag‐SIS) are first synthesized and characterized, and then the trinary LM‐μP‐SIS composites are evaluated. This includes analysis of microstructure, surface roughness, conductivity, electromechanical coupling, and LM smearing/leakage during mechanical loading, as well as the examination of the influence of filler particle size and composition. It is found that a binary combination of Ag‐EGaIn or EGaIn‐SIS does not result in the desired properties, and only trinary combination with conductive μP, preferably Ag, results in a printable, stretchable and sinter‐free composite. As an application, a digitally‐printed epidermal sticker for respiration monitoring is demonstrated.</jats:p>
収録刊行物
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- Advanced Materials Interfaces
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Advanced Materials Interfaces 9 (5), 2101913-, 2022-01-05
Wiley
