A novel approach for development of printed circuit board from biofiber based composites

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  • Kurki N. Bharath
    Department of Mechanical Engineering G M Institute of Technology Davangere Karnataka India
  • Puttegowda Madhu
    Department of Mechanical Engineering Malnad College of Engineering Hassan Karnataka India
  • Thyavihalli G. Y. Gowda
    Natural Composites Research Group Lab, Department of Mechanical and Process Engineering, The Sirindhorn International Thai‐German Graduate School of Engineering King Mongkut's University of Technology North Bangkok Bangkok Thailand
  • Akarsh Verma
    Department of Mechanical and Industrial Engineering Indian Institute of Technology Roorkee India
  • Mavinkere R. Sanjay
    Natural Composites Research Group Lab, Department of Mechanical and Process Engineering, The Sirindhorn International Thai‐German Graduate School of Engineering King Mongkut's University of Technology North Bangkok Bangkok Thailand
  • Suchart Siengchin
    Natural Composites Research Group Lab, Department of Mechanical and Process Engineering, The Sirindhorn International Thai‐German Graduate School of Engineering King Mongkut's University of Technology North Bangkok Bangkok Thailand

書誌事項

公開日
2020-07-31
権利情報
  • http://onlinelibrary.wiley.com/termsAndConditions#vor
DOI
  • 10.1002/pc.25732
公開者
Wiley

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説明

<jats:title>Abstract</jats:title><jats:p>Over past few decades, the electronic boards density and performance are enhanced by entrenching the components in the interior surfaces of the printed circuit boards (PCBs).The worthiness of this novel innovation has to be probed to warranty the functioning of electronic boards acquiesced to callous environments. In this study, a novel advancement concentrating on the development of bio‐based materials for the PCB applications has been documented. The bio‐based composite from rice husk‐epoxy resin could impendingly substitute the conventional synthetic fiber reinforced epoxy composites in PCB applications. The essential properties of biocomposites were assessed such as tensile and bending properties, dielectric property, thermal properties, moisture absorption, microdrilling, biodegradability, and flammability. Results obtained found that, these biocomposites were promising for PCB application.</jats:p>

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