Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs

DOI Web Site Web Site 1 Citations

Journal

Microelectronics Reliability

Microelectronics Reliability 78 25-37, 2017-11

Elsevier BV

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CRID

1360021800757053824
DOI

10.1016/j.microrel.2017.07.095
ISSN

00262714
Web Site

https://api.elsevier.com/content/article/PII:S0026271417303876?httpAccept=text/xml

https://api.elsevier.com/content/article/PII:S0026271417303876?httpAccept=text/plain
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