Effect of crystal orientation on ohmic contact formation for n-type gallium nitride

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The present paper describes the influence of surface orientation of n-type GaN on the electrical properties and the interfacial reaction between GaN and Ti during annealing. Although the contact formed on (0001) Ga-face of GaN performs the highest electrical conductance in the as-deposited state, the conductance deteriorates significantly by annealing even at a low temperature of 773 K. A considerable amount of Ti-Ga intermetallic compounds is formed at the deteriorated interfaces, to which the deterioration is attributed.

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