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Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding

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CiNii Books

Journal

Microelectronic Engineering

Microelectronic Engineering 87 (5-8), 1590-1593, 2010-05

Elsevier BV

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Details 詳細情報について

CRID

1360292620374993280
DOI

10.1016/j.mee.2009.11.010
ISSN

01679317
Web Site

https://api.elsevier.com/content/article/PII:S0167931709006637?httpAccept=text/xml

https://api.elsevier.com/content/article/PII:S0167931709006637?httpAccept=text/plain
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