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- Sumeet Walia
- Functional Materials and Microsystems Research Group, RMIT University 1 , Melbourne, Victoria 3000, Australia
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- Sivacarendran Balendhran
- Functional Materials and Microsystems Research Group, RMIT University 1 , Melbourne, Victoria 3000, Australia
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- Yichao Wang
- School of Electrical and Computer Engineering, RMIT University 2 , Melbourne, Victoria 3000, Australia
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- Rosmalini Ab Kadir
- School of Electrical and Computer Engineering, RMIT University 2 , Melbourne, Victoria 3000, Australia
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- Ahmad Sabirin Zoolfakar
- School of Electrical and Computer Engineering, RMIT University 2 , Melbourne, Victoria 3000, Australia
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- Paul Atkin
- School of Electrical and Computer Engineering, RMIT University 2 , Melbourne, Victoria 3000, Australia
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- Jian Zhen Ou
- School of Electrical and Computer Engineering, RMIT University 2 , Melbourne, Victoria 3000, Australia
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- Sharath Sriram
- Functional Materials and Microsystems Research Group, RMIT University 1 , Melbourne, Victoria 3000, Australia
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- Kourosh Kalantar-zadeh
- School of Electrical and Computer Engineering, RMIT University 2 , Melbourne, Victoria 3000, Australia
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- Madhu Bhaskaran
- Functional Materials and Microsystems Research Group, RMIT University 1 , Melbourne, Victoria 3000, Australia
説明
<jats:p>While layered materials are increasingly investigated for their potential in nanoelectronics, their functionality and efficiency depend on charge injection into the materials via metallic contacts. This work explores the characteristics of different metals (aluminium, tungsten, gold, and platinum) deposited on to nanostructured thin films made of two-dimensional (2D) MoS2 flakes. Metals are chosen based on their work functions relative to the electron affinity of MoS2. It is observed, and analytically verified that lower work functions of the contact metals lead to smaller Schottky barrier heights and consequently higher charge carrier injection through the contacts.</jats:p>
収録刊行物
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- Applied Physics Letters
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Applied Physics Letters 103 (23), 232105-, 2013-12-02
AIP Publishing
