Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications
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- Zulfiqar Ali
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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- Yuan Gao
- College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
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- Bo Tang
- College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
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- Xinfeng Wu
- College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
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- Ying Wang
- College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China
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- Maohua Li
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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- Xiao Hou
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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- Linhong Li
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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- Nan Jiang
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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- Jinhong Yu
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
説明
<jats:p>With the increasing integration and miniaturization of electronic devices, heat dissipation has become a major challenge. The traditional printed polymer circuit board can no longer meet the heat dissipation demands of microelectronic equipment. If the heat cannot be removed quickly and effectively, the efficiency of the devices will be decreased and their lifetime will be shortened. In addition, the development of the aerospace, automobiles, light emitting diode (LED{ TA \1 “LED; lightemitting diode” \s “LED” \c 1 }) and energy harvesting and conversion has gradually increased the demand for low-density and high thermal conductive materials. In recent years, carbon fiber (CF{ TA \1 “CF; carbon fiber” \c 1 }) has been widely used for the preparation of polymer composites due to its good mechanical property and ultra-high thermal conductivity. CF materials easily form thermal conduction paths through polymer composites to improve the thermal conductivity. This paper describes the research progress, thermal conductivity mechanisms, preparation methods, factors influencing thermal conductivity and provides relevant suggestions for the development of CF composites for thermal management.</jats:p>
収録刊行物
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- Polymers
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Polymers 13 (1), 169-, 2021-01-05
MDPI AG