Cryogenic flip-chip interconnection for silicon qubit devices

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<jats:title>Abstract</jats:title> <jats:p>Interfacing qubits with peripheral control circuitry poses one of the major common challenges toward realization of large-scale quantum computation. Spin qubits in silicon quantum dots (QDs)are particularly promising for scaling up, owing to the potential benefits from the know-how of the semiconductor industry. In this paper, we focus on the interposer technique as one of the potential solutions for the quantum–classical interface problem and report DC and RF characterization of a silicon QD device mounted on an interposer. We demonstrate flip-chip interconnection with the qubit device down to 4.2 K by observing Coulomb diamonds. We furthermore propose and demonstrate a laser-cut technique to disconnect peripheral circuits no longer in need. These results may pave the way toward system-on-a-chip quantum–classical integration for future quantum processors.</jats:p>

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