Conductive and semi-transparent Cu thin film fabricated using molecular precursor solutions

DOI Web Site Web Site 3 Citations 17 References

Search this article

Description

Abstract A semi-transparent Cu thin film with a thickness of 40 nm and a tensile strength of 36 MPa onto the glass substrate deposited through a solution-based process, by heat-treating the spin-coated precursor film at 350 °C with Ar gas flowing at a rate of 1.5 L min−1. The Cu thin film is more than ca. 30% transparent in the visible region and exhibits 40−100% reflectance in the infrared region. The electrical resistivity of the Cu thin film is 4.7(6)×10−5 Ω cm.

Journal

Citations (3)*help

See more

References(17)*help

See more

Related Projects

See more

Report a problem

Back to top