Topographic Anaglyphs from Detailed Digital Elevation Models Covering Inland and Seafloor for the Tectonic Geomorphology Studies in and around Yoron Island, Ryukyu Arc, Japan

  • Hideaki Goto
    Department of Geography, Hiroshima University, Higashihiroshima 739-8522, Japan
  • Kohsaku Arai
    The National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki 305-8560, Japan
  • Taichi Sato
    The National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki 305-8560, Japan

書誌事項

公開日
2018-09-29
資源種別
journal article
権利情報
  • https://creativecommons.org/licenses/by/4.0/
DOI
  • 10.3390/geosciences8100363
公開者
MDPI AG

説明

<jats:p>Anaglyphs produced using a digital elevation model (DEM) are effective to identify the characteristic tectono–geomorphic features. The objective of this study is to reinvestigate the tectonic geomorphology and to present novel tectonic maps of the late Quaternary in and around the Yoron island based on the interpretation of extensive topographical anaglyphs along the map areas that cover the inland and seafloor. Vintage aerial photographs are used to produce the 3-m mesh inland digital surface model (DSM); further, the 0.6-s to 2-s-mesh seafloor DEM is processed using the cloud point data generated through previous surveys. Thus, we identify anticlinal deformation on both the Pleistocene marine terrace and the seafloor to the north of the island. The deformation axis extends in a line and is parallel to the general trend of the island shelf. The Tsujimiya fault cuts the marine terraces, which extend to the Yoron basin’s seafloor. If we assume that the horizontal compressive stress axis is perpendicular to the island shelf, these properties can easily explain the distribution and style of the active faults and deformation. This study presents an effective methodology to understand the island arc tectonics, especially in case of small isolated islands.</jats:p>

収録刊行物

  • Geosciences

    Geosciences 8 (10), 363-, 2018-09-29

    MDPI AG

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