Tailoring the thermoelectric and structural properties of Cu–Sn based thiospinel compounds [CuM<sub>1+x</sub>Sn<sub>1−x</sub>S<sub>4</sub> (M = Ti, V, Cr, Co)]

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<p>The thermoelectric properties of a series of Cu–Sn based thiospinel compounds by screening a variety of transition elements (M = Ti, V, Cr, Co) as a potential substituent at the Sn-site (both p- and n-type thiospionels) are reported and discussed.</p>

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