A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

詳細情報 詳細情報について

• CRID

  1360855569099791104

• DOI

  10.1007/s00170-005-0364-7

• ISSN

  14333015

  02683768

• Web Site

  http://link.springer.com/content/pdf/10.1007/s00170-005-0364-7.pdf

  http://link.springer.com/article/10.1007/s00170-005-0364-7/fulltext.html

  http://link.springer.com/content/pdf/10.1007/s00170-005-0364-7

• データソース種別

  • Crossref