Temperature Cycling Reliability Assessment of Die Attachment on Bare Copper by Pressureless Nanosilver Sintering
書誌事項
- 公開日
- 2015-06
- 権利情報
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- https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
- DOI
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- 10.1109/tdmr.2015.2417114
- 公開者
- Institute of Electrical and Electronics Engineers (IEEE)
この論文をさがす
収録刊行物
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- IEEE Transactions on Device and Materials Reliability
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IEEE Transactions on Device and Materials Reliability 15 (2), 214-219, 2015-06
Institute of Electrical and Electronics Engineers (IEEE)
