3D Shape Characterization and Image-Based DEM Simulation of the Lunar Soil Simulant FJS-1

DOI Web Site 被引用文献26件
  • Takashi Matsushima
    Associate Professor, Dept. of Engineering Mechanics and Energy, Univ. of Tsukuba, Tsukuba, Ibaraki, 305-8573, Japan (corresponding author).
  • Jun Katagiri
    Associate Professor, Dept. of Engineering Mechanics and Energy, Univ. of Tsukuba, Tsukuba, Ibaraki, 305-8573, Japan (corresponding author).
  • Kentaro Uesugi
    Associate Professor, Dept. of Engineering Mechanics and Energy, Univ. of Tsukuba, Tsukuba, Ibaraki, 305-8573, Japan (corresponding author).
  • Akira Tsuchiyama
    Associate Professor, Dept. of Engineering Mechanics and Energy, Univ. of Tsukuba, Tsukuba, Ibaraki, 305-8573, Japan (corresponding author).
  • Tsukaka Nakano
    Associate Professor, Dept. of Engineering Mechanics and Energy, Univ. of Tsukuba, Tsukuba, Ibaraki, 305-8573, Japan (corresponding author).

書誌事項

公開日
2009-01
DOI
  • 10.1061/(asce)0893-1321(2009)22:1(15)
公開者
American Society of Civil Engineers (ASCE)

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説明

This paper describes a procedure used to characterize the three-dimensional 3D grain shape of lunar soil and undertake simulations of lunar soil by image-based discrete element method DEM. Given that detailed 3D grain-shape information is unavailable for real lunar soil, a simulant material, FJS-1, is used in this study. We use the high-resolution micro X-ray CT system at SPring-8, a synchrotron radiation facility in Japan, to visualize precise 3D images of the granular assembly of FJS-1. A newly developed image- analysis procedure is then applied to identify individual grains. Using the obtained grain-shape data, a sufficient number of FJS-1 grains are directly modeled for DEM simulation using an efficient modeling scheme. A series of particle flow simulations are then performed with the modeled grains. The resulting slope angles are in good agreement with experimental results. We discuss the effect on the slope angle of grain parameters such as contact stiffness, restitution coefficient, and interparticle friction.

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