Surface-force-induced deformations of monodisperse polystyrene spheres on planar silicon substrates

DOI PDF 被引用文献6件
  • D. S. Rimai
    Research and Product Development, Eastman Kodak Company, 1999 Lake Avenue, Rochester, New York 14650-2106
  • L. P. DeMejo
    Research and Product Development, Eastman Kodak Company, 1999 Lake Avenue, Rochester, New York 14650-2106
  • R. C. Bowen
    Analytical Technology Division, Eastman Kodak Company, 1999 Lake Avenue, Rochester, New York 14650

書誌事項

公開日
1990-12-15
DOI
  • 10.1063/1.346888
公開者
AIP Publishing

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説明

<jats:p>The contact radii between polystyrene spheres, having diameters between approximately 1.5 and 12 μm, and polished silicon wafers, arising from adhesion forces, were determined using scanning electron microscopy. It was found that the contact radius varied approximately as the square root of the particle radius. This dependence is consistent with nonelastic response models of adhesion, such as those proposed by Krupp [H. Krupp, Adv. Colloid Interface Sci. 1, 111 (1967)] and by Maugis and Pollock [D. Maugis and H. M. Pollock, Acta Metall. 32, 1323 (1984)], but is inconsistent with various elastic response models which assume Hertzian deformations. The experimentally determined contact radii are also compared to those obtained for polystyrene spheres on a polyurethane substrate [D. S. Rimai, L. P. DeMejo, and R. C. Bowen, J. Appl. Phys. 66, 3574 (1989)].</jats:p>

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