Capacitance characterization of tapered through-silicon-via considering MOS effect
書誌事項
- 公開日
- 2014-02
- 権利情報
-
- https://www.elsevier.com/tdm/userlicense/1.0/
- https://www.elsevier.com/legal/tdmrep-license
- https://doi.org/10.15223/policy-017
- https://doi.org/10.15223/policy-037
- https://doi.org/10.15223/policy-012
- https://doi.org/10.15223/policy-029
- https://doi.org/10.15223/policy-004
- DOI
-
- 10.1016/j.mejo.2013.10.015
- 公開者
- Elsevier BV
この論文をさがす
収録刊行物
-
- Microelectronics Journal
-
Microelectronics Journal 45 (2), 205-210, 2014-02
Elsevier BV
