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- S. H. Baek
- Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- J. Park
- Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- D. M. Kim
- Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- V. A. Aksyuk
- Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD 20899, USA.
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- R. R. Das
- Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- S. D. Bu
- Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- D. A. Felker
- Department of Physics, University of Wisconsin, Madison, WI 53706, USA.
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- J. Lettieri
- Department of Materials Science and Engineering, Penn State University, University Park, PA 16802, USA.
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- V. Vaithyanathan
- Department of Materials Science and Engineering, Penn State University, University Park, PA 16802, USA.
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- S. S. N. Bharadwaja
- Department of Materials Science and Engineering, Penn State University, University Park, PA 16802, USA.
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- N. Bassiri-Gharb
- Department of Materials Science and Engineering, Penn State University, University Park, PA 16802, USA.
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- Y. B. Chen
- Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109, USA.
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- H. P. Sun
- Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109, USA.
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- C. M. Folkman
- Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- H. W. Jang
- Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- D. J. Kreft
- Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- S. K. Streiffer
- Center for Nanoscale Materials, Argonne National Laboratory, Argonne, IL 60439, USA.
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- R. Ramesh
- Department of Materials Science and Engineering, University of California, Berkeley, CA 94720, USA.
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- X. Q. Pan
- Department of Materials Science and Engineering, University of Michigan, Ann Arbor, MI 48109, USA.
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- S. Trolier-McKinstry
- Department of Materials Science and Engineering, Penn State University, University Park, PA 16802, USA.
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- D. G. Schlom
- Department of Materials Science and Engineering, Penn State University, University Park, PA 16802, USA.
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- M. S. Rzchowski
- Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD 20899, USA.
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- R. H. Blick
- Department of Electrical and Computer Engineering, University of Wisconsin, Madison, WI 53706, USA.
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- C. B. Eom
- Department of Materials Science and Engineering, University of Wisconsin, Madison, WI 53706, USA.
説明
<jats:p>High-quality piezoelectric thin films are grown and exhibit superior properties for microelectromechanical systems.</jats:p>
収録刊行物
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- Science
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Science 334 (6058), 958-961, 2011-11-18
American Association for the Advancement of Science (AAAS)