A Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering Technique
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- Sung-Jun Joo
- Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791, South Korea
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- Sung-Hyeon Park
- Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791, South Korea
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- Chang-Jin Moon
- Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791, South Korea
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- Hak-Sung Kim
- Department of Mechanical Convergence Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791, South Korea
書誌事項
- 公開日
- 2015-03-06
- DOI
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- 10.1021/am506765p
- 公開者
- American Chemical Society (ACS)
この論文をさがす
収録刊行物
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- ACS Applied Materials & Interfaces
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ACS Applied Materials & Interfaces 7 (10), 5674-5684, 2015-03-06
American Chemical Society (ACS)